The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Jul. 02, 2009
Applicants:
Akira Tada, Kawasaki, JP;
Hiroki Tanabe, Kawasaki, JP;
Yoshinori Okada, Kawasaki, JP;
Ikuo Kudo, Kawasaki, JP;
Inventors:
Akira Tada, Kawasaki, JP;
Hiroki Tanabe, Kawasaki, JP;
Yoshinori Okada, Kawasaki, JP;
Ikuo Kudo, Kawasaki, JP;
Assignee:
Renesas Electronics Corporation, Kanagawa, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/822 (2006.01);
U.S. Cl.
CPC ...
Abstract
A package-on-package includes a semiconductor package, and a coil provided at the semiconductor package. The semiconductor package includes a bottom face, and a solder ball protruded from the bottom face. An axis of the coil is inclined with respect to the normal line of the bottom face.