The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Feb. 29, 2012
Shuji Yoneda, Kagoshima, JP;
Masato Oishi, Kanagawa, JP;
Tamotsu Shinohara, Kagoshima, JP;
Shinji Watanabe, Kagoshima, JP;
Koji Miyata, Kagoshima, JP;
Seiji Fukae, Kagoshima, JP;
Kenji Yamauchi, Kagoshima, JP;
Yoichi Goto, Kagoshima, JP;
Masakazu Baba, Kagoshima, JP;
Shuji Yoneda, Kagoshima, JP;
Masato Oishi, Kanagawa, JP;
Tamotsu Shinohara, Kagoshima, JP;
Shinji Watanabe, Kagoshima, JP;
Koji Miyata, Kagoshima, JP;
Seiji Fukae, Kagoshima, JP;
Kenji Yamauchi, Kagoshima, JP;
Yoichi Goto, Kagoshima, JP;
Masakazu Baba, Kagoshima, JP;
Sony Corporation, Tokyo, JP;
Abstract
A semiconductor device having a substrate including a photodiode; a resin layer formed on an upper surface of the substrate, the resin layer not covering a light receiving region of the photodiode, the resin layer including at least one groove surrounding the light receiving region; and a molding resin portion formed by mold-sealing the photodiode with the resin layer thereon so as not to cover the light receiving region.