The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Aug. 03, 2010
Gen Watari, Fukuoka-ken, JP;
Satoshi Shimizu, Fukuoka-ken, JP;
Mami Yamamoto, Fukuoka-ken, JP;
Hidenori Egoshi, Fukuoka-ken, JP;
Hiroaki Oshio, Fukuoka-ken, JP;
Tatsuo Tonedachi, Fukuoka-ken, JP;
Kazuhisa Iwashita, Fukuoka-ken, JP;
Tetsuro Komatsu, Fukuoka-ken, JP;
Teruo Takeuchi, Fukuoka-ken, JP;
Gen Watari, Fukuoka-ken, JP;
Satoshi Shimizu, Fukuoka-ken, JP;
Mami Yamamoto, Fukuoka-ken, JP;
Hidenori Egoshi, Fukuoka-ken, JP;
Hiroaki Oshio, Fukuoka-ken, JP;
Tatsuo Tonedachi, Fukuoka-ken, JP;
Kazuhisa Iwashita, Fukuoka-ken, JP;
Tetsuro Komatsu, Fukuoka-ken, JP;
Teruo Takeuchi, Fukuoka-ken, JP;
Kabushiki Kaisha Toshiba, Tokyo, JP;
Abstract
According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.