The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Feb. 17, 2010
Applicants:
Izuru Nakai, Osaka, JP;
Masahiro Mori, Osaka, JP;
Yukio Nishikawa, Osaka, JP;
Inventors:
Assignee:
Panasonic Corporation, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/005 (2006.01);
U.S. Cl.
CPC ...
Abstract
By irradiating laser lightobliquely onto a substrate, the laser soldering apparatus reduces the laser light passing through an insertion holein the substrateand prevents damage to low-heat-resistance portions of a componentdisposed on the rear surface side of the substrate. Moreover, the substratecan be observed from a normal direction with a camera. Therefore, even if the insertion holefor inserting a component lead or the like is provided in the substrate, the laser light does not leak out to the side of a component mounting surfaceof the substrate