The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 03, 2013

Filed:

Dec. 09, 2010
Applicants:

Michel Marty, Varces, FR;

Didier Dutartre, Meylan, FR;

Francois Roy, Seyssins, FR;

Pascal Besson, Notre Dame de Message, FR;

Jens Prima, Grenoble, FR;

Inventors:

Michel Marty, Varces, FR;

Didier Dutartre, Meylan, FR;

Francois Roy, Seyssins, FR;

Pascal Besson, Notre Dame de Message, FR;

Jens Prima, Grenoble, FR;

Assignees:

STMicroelectronics S.A., Montrouge, FR;

STMicroelectronics (Crolles 2) SAS, Crolles Cedex, FR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/46 (2006.01); H01L 31/0232 (2006.01); H01L 27/148 (2006.01);
U.S. Cl.
CPC ...
Abstract

A process for producing a microelectronic device includes producing a first semiconductor substrate which includes a first layer and a second layer present between a first side and a second side of the substrate. First electronic components and an interconnecting part are produced on and above the second side. The substrate is then thinned by a first selective etch applied from the first side and stopping on the first layer followed by a second selective etch stopping on the second layer. A second substrate is attached over the interconnecting part. The electronic components may comprise optoelectronic devices which are illuminated through the second layer.


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