The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2013
Filed:
Nov. 13, 2009
Hideta Arai, Ibaraki, JP;
Naoki Higuchi, Ibaraki, JP;
Hideta Arai, Ibaraki, JP;
Naoki Higuchi, Ibaraki, JP;
JX Nippon Mining & Metals Corporation, Tokyo, JP;
Abstract
Provided is a copper foil for a printed circuit with an electrodeposited ternary-alloy layer composed of copper, cobalt and nickel formed on a surface of the copper foil, wherein the electrodeposited layer comprises dendritic particles grown on the copper foil surface, and the entire surface of the copper foil is covered with particles having an area as seen from above the copper foil surface of 0.1 to 0.5 μmat a density of 1000 particles/10000 μmor less, particles exceeding 0.5 μmat a density of 100 particles/10000 μmor less, and particles less than 0.1 μmas the remainder. Roughening particles formed dendritically in a roughening treatment based on copper-cobalt-nickel alloy plating are inhibited from shedding from the copper foil surface, and the phenomenon known as powder falling and uneven treatment are thereby inhibited.