The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2013

Filed:

Jan. 11, 2011
Applicant:

Chiho Ogihara, Kanagawa, JP;

Inventor:

Chiho Ogihara, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor apparatus includes: a wiring board; a lid; and gap filling resin. A semiconductor chip is mounted on the wiring board. The lid includes inlet portions for injecting resin. The semiconductor chip is covered with the lid on the wiring board. The gap filling resin bonds the wiring board and the lid inside the lid.


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