The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2013
Filed:
Oct. 12, 2011
Applicant:
Hee Ra Roh, Seoul, KR;
Inventor:
Hee Ra Roh, Seoul, KR;
Assignee:
SK Hynix Inc., Gyeonggi-do, KR;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 21/00 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A semiconductor package includes a substrate having an upper surface and a lower surface which faces away from the upper surface, and possessing a recess which is defined on the upper surface; and a semiconductor chip mounted to the upper surface of the substrate, having one surface which faces the upper surface and the other surface which faces away from the one surface, and warped in a smile shape such that a warped edge portion of the semiconductor chip is inserted into the recess.
Quick Actions:
Roh, Hee. (2013). Semiconductor package (U.S. Patent No. 8519522). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8519522
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile