The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2013
Filed:
Apr. 19, 2011
Chia-hung Hsu, New Taipei, TW;
Ching-san Lin, Wufeng Township Taichung County, TW;
Chin-yung Chen, Daxi Township Taoyuan County, TW;
Chia-Hung Hsu, New Taipei, TW;
Ching-San Lin, Wufeng Township Taichung County, TW;
Chin-Yung Chen, Daxi Township Taoyuan County, TW;
Raydium Semiconductor Corporation, Hsinchu County, TW;
Abstract
A die structure and a die connecting method using the same are provided. The die structure includes a die and a bump structure. The bump structure includes a body and a solder layer. The body is disposed on the die. The solder layer is disposed on the body. The method includes providing a die structure mentioned above, providing a circuit board mentioned above, and soldering the solder layer of the die structure with the tine layer on the copper block of the circuit board. In different embodiments, a tin layer is omitted from the circuit board, wherein the solder layer of the die structure is directly soldered onto the surface of the copper block.