The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2013

Filed:

Aug. 30, 2005
Applicants:

Hiroaki Yamaguchi, Ichihara, JP;

Masato Murakami, Ichihara, JP;

Masafumi Kohda, Ichihara, JP;

Inventors:

Hiroaki Yamaguchi, Ichihara, JP;

Masato Murakami, Ichihara, JP;

Masafumi Kohda, Ichihara, JP;

Assignee:

UBE Industries, Ltd., Yamaguchi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 15/08 (2006.01); C08G 73/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polyimide wherein a tetracarboxylic dianhydride including 3,3',4,4′-phenyltetracarboxylic dianhydride as the essential component is the starting tetracarboxylic dianhydride component, and an amine comprising between 0.5 and 30 mole percent of a diamine represented by the following general formula is the starting diamine component. (wherein A is a direct bond or a crosslinking group, and R-Reach represent a substituent). It is possible to obtain a polyimide, a polyimide film and a laminated body with an improved adhesion property and an improved moisture permeation rate, even without surface treatment, comprising, as the essential tetracarboxylic dianhydride, 3,3′,4,4′-biphenyltetracarboxylic dianhydride which has conventionally only yielded polyimides with low adhesive strength.


Find Patent Forward Citations

Loading…