The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2013

Filed:

Jun. 22, 2010
Applicants:

Dong-youn Shin, Daejeon, KR;

Taik-min Lee, Daejeon, KR;

Dong-soo Kim, Daejeon, KR;

Inventors:

Dong-Youn Shin, Daejeon, KR;

Taik-Min Lee, Daejeon, KR;

Dong-Soo Kim, Daejeon, KR;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 1/32 (2006.01); B05D 1/36 (2006.01); B05D 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided is a method for forming a micropattern using a mask template. The method includes: forming a mask template on a substrate, wherein the mask template has an exposure section through which a portion of the substrate is exposed to the exterior and a non-exposure section provided by a polymer material applied on the remaining portion of the substrate; supplying conductive ink to the top of the mask template to deposit the conductive ink on the non-exposure section and on the substrate exposed through the exposure section; and heat treating the conductive ink in order to extract the conductive ink nanoclusters dissolved or dispersed in the conductive ink, wherein the conductive ink nanoclusters disposed on the non-exposure section are bound to the non-exposure section to form an insulating pattern having electrical insulating property, while the conductive ink nanoclusters disposed on the substrate form a conductive pattern having electroconductive property. The method enables formation of a micropattern without any alignment error between patterns in the case of a direct printing process.


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