The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2013

Filed:

Jun. 24, 2008
Applicants:

Mu-chi Hsu, Taipei Hsien, TW;

Vladimir Stepanovich Kondratenko, Moscow, RU;

Inventors:

Mu-Chi Hsu, Taipei Hsien, TW;

Vladimir Stepanovich Kondratenko, Moscow, RU;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/14 (2006.01); B23K 26/36 (2006.01); C03B 33/09 (2006.01); C03B 33/10 (2006.01); B23K 26/00 (2006.01); B23K 26/40 (2006.01);
U.S. Cl.
CPC ...
C03B 33/093 (2013.01); C03B 33/102 (2013.01); C03B 33/09 (2013.01); B23K 26/0057 (2013.01); B23K 26/4075 (2013.01);
Abstract

An exemplary brittle non-metallic workpiece () defines a through hole (). An inner surface () for forming the through hole has no microcracks and burrs. A method for making a through hole in a brittle non-metallic substrate () is also provided. The method includes as follows: forming an enclosing sketched etch () engraved into a brittle non-metallic substrate with a given depth (H) from a surface of the brittle non-metallic substrate; placing a cooling object () on an excess portion () inside the enclosing sketched etch (); and extending the enclosing sketched etch through the brittle non-metallic substrate.


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