The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 27, 2013

Filed:

Mar. 02, 2010
Applicants:

Abhijeet Misra, Evanston, IL (US);

Jason Sebastian, Chicago, IL (US);

James A. Wright, Chicago, IL (US);

Inventors:

Abhijeet Misra, Evanston, IL (US);

Jason Sebastian, Chicago, IL (US);

James A. Wright, Chicago, IL (US);

Assignee:

QuesTek Innovations, LLC, Evanston, IL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C 9/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A lead-free copper alloy includes, in combination by weight, about 10.0% to about 20.0% bismuth, about 0.05% to about 0.3% phosphorous, about 2.2% to about 10.0% tin, up to about 5.0% antimony, and up to about 0.02% boron, the balance essentially copper and incidental elements and impurities. The alloy contains no more than about 0.05 wt. % or 0.10 wt. % lead.


Find Patent Forward Citations

Misra, Abhijeet. (2013). Lead-free, high-strength, high-lubricity copper alloys (U.S. Patent No. 8518192). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8518192

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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