The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2013
Filed:
Sep. 13, 2012
Applicants:
Tsuyoshi Kimura, Osaka, JP;
Yoshiyuki Nakai, Osaka, JP;
Masahiro Watanabe, Osaka, JP;
Inventors:
Assignee:
Toyo Tire & Rubber Co., Ltd., Osaka-shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 49/00 (2012.01);
U.S. Cl.
CPC ...
Abstract
The present invention provides a polishing pad used for planarizing inter layer dielectrics and the like by CMP (chemical mechanical polishing) in the manufacturing process of a semiconductor device, a method of producing the polishing pad and a method of producing a semiconductor device by using the polishing pad. The present invention relates to a semiconductor wafer polishing pad having grooves in a polishing surface and formed from a foamed polyurethane, wherein a processed surface of the groove comprising a side surface and a bottom surface has a surface roughness Ra of not more than 10.