The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8517174 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 27, 2013

Filed:

Jun. 22, 2010
Applicants:

Denise Marie Dacey, Glen Gardner, NJ (US);

Jonathan William Gillespie, Chatham, NJ (US);

Inventors:

Denise Marie Dacey, Glen Gardner, NJ (US);

Jonathan William Gillespie, Chatham, NJ (US);

Assignee:

Ethicon, Inc., Somerville, NJ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
A61B 19/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A package for a flat medical implant includes a flexible outer component, such as Tyvek®, including a first panel and a second panel foldable over said first panel for closing the package, and an inner component, such as paper, mechanically interlocked with the flexible outer component. A flat medical implant is held by the inner component. While the outer and inner components remains mechanically interconnected to one another, the upper ends of the first and second panels of the outer component are peelable away from one another for opening the package and accessing the flat medical implant at an upper end of the package.


Find Patent Forward Citations

Dacey, Denise. (2013). Dispensing packages for medical devices having two components that are mechanically interlocked and methods therefor (U.S. Patent No. 8517174). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8517174

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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