The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 27, 2013
Filed:
Dec. 01, 2008
Yusuke Hatanaka, Haibara-gun, JP;
Yoshinori Hotta, Aichi, JP;
Tadabumi Tomita, Haibara-gun, JP;
FUJIFILM Corporation, Tokyo, JP;
Abstract
An anisotropic conductive joint package in which an anisotropic conductive film is joined to at least one conductive material selected from among the group consisting of gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), a tin oxide doped with indium (ITO), molybdenum (Mo), iron (Fe), palladium (Pd), beryllium (Be), and rhenium (Re). The package is characterized in that: the anisotropic conductive film has an insulating base and conductive paths composed of conductive members, insulated from one another, and extending through the insulating base in the direction of the thickness of the insulating base, one ends of the conductive paths are exposed from one side of the insulating base, the other ends are exposed from the other side, the density of the conductive paths is 3,000,000 pieces/mmor more, the insulating base is a structural body composed of an anodic oxide film of an aluminum substrate having micropores, and each micropore does not have a branch structure along the depth. The package can be used as an anisotropic conductive member of an electronic component of a semiconductor device or the like or a connector for inspection even if the structure has a much higher degree of integration realized by drastically improving the installation density of the conductive paths.