The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Mar. 18, 2011
Jong-pil Son, Yongin-si, KR;
Seong-jin Jang, Seongnam-si, KR;
Byung-sik Moon, Seoul, KR;
Doo-young Kim, Seongnam-si, KR;
Hyoung-joo Kim, Seongnam-si, KR;
Ju-seop Park, Seongnam-si, KR;
Jong-Pil Son, Yongin-si, KR;
Seong-Jin Jang, Seongnam-si, KR;
Byung-Sik Moon, Seoul, KR;
Doo-Young Kim, Seongnam-si, KR;
Hyoung-Joo Kim, Seongnam-si, KR;
Ju-Seop Park, Seongnam-si, KR;
Samsung Electronics Co., Ltd., Yeongtong-gu, Suwon-si Gyeonggi-do, KR;
Abstract
Provided are an anti-fuse, an anti-fuse circuit, and a method of fabricating the anti-fuse. The anti-fuse includes a semiconductor substrate, an isolation region, a channel diffusion region, a gate oxide layer, and a gate electrode. The semiconductor substrate includes a top surface and a bottom portion, the bottom portion of the semiconductor substrate having a first conductivity type. The isolation region is disposed inward from the top surface of the semiconductor substrate to a first depth. The channel diffusion region is disposed inward from the top surface of the semiconductor substrate to a second depth, the second depth located at a depth where the channel diffusion region meets an upper boundary of the bottom portion of the semiconductor substrate. The channel diffusion region is surrounded by the isolation region, the first depth is a greater distance from the top surface of the semiconductor substrate than the second depth, and the channel diffusion region has a second conductivity type opposite to the first conductivity type. The gate oxide layer is disposed on the channel diffusion region, and the gate electrode is disposed on the gate oxide layer to cover a top surface of the gate oxide layer.