The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Nov. 16, 2010
Gary F. Goth, Pleasant Valley, NY (US);
William P. Kostenko, Poughkeepsie, NY (US);
Robert K. Mullady, Poughkeepsie, NY (US);
Allan C. Vandeventer, Poughkeepsie, NY (US);
Gary F. Goth, Pleasant Valley, NY (US);
William P. Kostenko, Poughkeepsie, NY (US);
Robert K. Mullady, Poughkeepsie, NY (US);
Allan C. Vandeventer, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An apparatus is provided for cooling an electronic system, which includes one or more electronic components across which air passing through the system flows. A cooling unit provides, via a coolant loop, system coolant to cool the electronic component(s), and to an air-to-liquid heat exchanger is coupled to the coolant loop downstream of the electronic component(s) to cool, in primary, liquid-cooling mode, air passing through the system. In primary, liquid-cooling mode, the cooling unit provides cooled system coolant to cool the electronic component(s), and provides system coolant to the air-to-liquid heat exchanger to cool at least a portion of air passing through the electronic system, and in a secondary, air-cooling mode, system coolant flows from cooling the electronic component(s) to the air-to-liquid heat exchanger for rejecting, via the system coolant, heat from the electronic component(s) to air passing across the air-to-liquid heat exchanger.