The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2013

Filed:

Jul. 20, 2010
Applicants:

William T. Bandy, Iv, Fremont, CA (US);

Dylan J. Boday, Tucson, AZ (US);

Peter J. Golcher, Los Gatos, CA (US);

Icko E. T. Iben, Santa Clara, CA (US);

Sassan K. Shahidi, San Jose, CA (US);

Joyce L. S. Tang, Dublin, CA (US);

Inventors:

William T. Bandy, IV, Fremont, CA (US);

Dylan J. Boday, Tucson, AZ (US);

Peter J. Golcher, Los Gatos, CA (US);

Icko E. T. Iben, Santa Clara, CA (US);

Sassan K. Shahidi, San Jose, CA (US);

Joyce L. S. Tang, Dublin, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H02H 9/00 (2006.01); H02H 3/20 (2006.01); H02H 9/04 (2006.01); H02H 3/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

A system in one embodiment includes a cable having a plurality of cable leads, and a multi-diode chip having a pad-side not facing the cable. The multi-diode chip includes a plurality of sets of contact pads on the pad-side of the multi-diode chip, and a plurality of crossed diode sets, wherein each set of crossed diodes is coupled between a first contact pad and a second contact pad of one set of contact pads, wherein at least two of the plurality of cable leads are coupled via wire-bonding to one of the plurality of sets of contact pads of the multi-diode chip for providing electrostatic discharge (ESD) protection for at least one element of the electronic device coupled to the at least two cable leads.


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