The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8513815 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 20, 2013

Filed:

Jul. 21, 2011
Applicants:

Anthony G. Aipperspach, Rochester, MN (US);

Todd A. Christensen, Rochester, MN (US);

John E. Sheets, Ii, Zumbrota, MN (US);

Inventors:

Anthony G. Aipperspach, Rochester, MN (US);

Todd A. Christensen, Rochester, MN (US);

John E. Sheets, II, Zumbrota, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method and structures are provided for implementing an integrated circuit with an enhanced wiring structure of mixed double density and high performance wires in a common plane. A wiring structure includes a first wire having a first plane and a first via to a second wire in a second plane having a second via and a third wire having the first plane with height equal to the first wire and the first via, and a third via having a height equal to the second wire and the second via.


Find Patent Forward Citations

Aipperspach, Anthony. (2013). Implementing integrated circuit mixed double density and high performance wire structure (U.S. Patent No. 8513815). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8513815

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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