The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Jul. 29, 2009
Masamoto Tago, Tokyo, JP;
Masamoto Tago, Tokyo, JP;
NEC Corporation, Tokyo, JP;
Abstract
There is provided a semiconductor device and a manufacturing method therefor, the semiconductor device requiring flip-chip mounting of a fine pitch electrode, wherein the fine electrode is easily manufactured, resin sealing is not required, and reliability can be improved. In the semiconductor device, one or more LSI chips (), having an insulating layer () surface and an electrode () surface on one side, and a substrate (), having an insulating layer () surface and an electrode () surface on one side, are bonded by having surfaces of the electrodes and surfaces of the insulating layers face each other via a bonding layer () made in a thin film form, in a region excluding the surfaces of the electrodes () and the surfaces of the insulating layers () in areas surrounding the electrodes.