The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Jul. 31, 2007
Applicants:
Takaki Kurita, Kawasaki, JP;
Osamu Igawa, Kawasaki, JP;
Inventors:
Takaki Kurita, Kawasaki, JP;
Osamu Igawa, Kawasaki, JP;
Assignee:
Fujitsu Semiconductor Limited, Yokohama, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
After a semiconductor chip is cut out, an In-10 atom % Ag pellet is placed on a metal film. Next, an epoxy sheet on a stiffener is stuck to a ceramic substrate. At this time, the In alloy pellet is sandwiched between a central protrusion portion and the metal film. Then, an In alloy film is formed from the In alloy pellet by heating, melting, and then cooling the In alloy pellet. As a result, the semiconductor chip and a heat spreader are bonded via the metal film and the In alloy film.