The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2013

Filed:

Sep. 13, 2006
Applicants:

Tetsuya Osajima, Shizuoka, JP;

Ryuji Sugiura, Shizuoka, JP;

Kazuhiro Atsumi, Shizuoka, JP;

Inventors:

Tetsuya Osajima, Shizuoka, JP;

Ryuji Sugiura, Shizuoka, JP;

Kazuhiro Atsumi, Shizuoka, JP;

Assignee:

Hamamatsu Photonics K.K., Hamamatsu-shi, Shizuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/38 (2006.01); B23K 26/073 (2006.01);
U.S. Cl.
CPC ...
Abstract

In the laser processing method, the cross-sectional form of laser light L at a converging point P is such that the maximum length in a direction perpendicular to a line to cutis shorter than the maximum length in a direction parallel to the line to cut. Therefore, when seen from the incident direction of the laser light L, a modified regionformed within a silicon waferhas such a shape that the maximum length in the direction perpendicular to the line to cutis shorter than the maximum length in the direction parallel to the line to cut. Forming the modified regionhaving such a shape within the objectcan restrain twist hackles from occurring on cut surfaces when cutting the objectfrom the modified regionacting as a cutting start point, thereby making it possible to improve the flatness of the cut surfaces.


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