The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Jun. 29, 2011
Malcolm Abbott, San Jose, CA (US);
Maxim Kelman, Mountain View, CA (US);
Eric Rosenfeld, Sunnyvale, CA (US);
Elena Rogojina, Los Altos, CA (US);
Giuseppe Scardera, Sunnyvale, CA (US);
Malcolm Abbott, San Jose, CA (US);
Maxim Kelman, Mountain View, CA (US);
Eric Rosenfeld, Sunnyvale, CA (US);
Elena Rogojina, Los Altos, CA (US);
Giuseppe Scardera, Sunnyvale, CA (US);
Innovalight, Inc., Sunnyvale, CA (US);
Abstract
A method of forming a floating junction on a substrate is disclosed. The method includes providing the substrate doped with boron atoms, the substrate comprising a front surface and a rear surface. The method also includes depositing a set of masking particles on the rear surface in a set of patterns; and heating the substrate in a baking ambient to a first temperature and for a first time period in order to create a particle masking layer. The method further includes exposing the substrate to a phosphorous deposition ambient at a second temperature and for a second time period, wherein a front surface PSG layer, a front surface phosphorous diffusion, a rear surface PSG layer, and a rear surface phosphorous diffusion are formed, and wherein a first phosphorous dopant surface concentration in the substrate proximate to the set of patterns is less than a second dopant surface concentration in the substrate not proximate to the set of patterns. The method also includes exposing the substrate to a set of etchants for a third time period, wherein the front surface PSG layer and the rear surface PSG layer are substantially removed; depositing a front surface SiNlayer and a rear surface SiNlayer; and forming a rear metal contact on the rear surface through the rear surface SiNlayer proximate to the set of patterns.