The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Jul. 10, 2007
Jan Dijkema, Zutphen, NL;
Edze Jan Visscher, Utrecht, NL;
Jan Dijkema, Zutphen, NL;
Edze Jan Visscher, Utrecht, NL;
Bonar B.V., Arnhem, NL;
Abstract
A tufted nonwoven with improved stitch holding, a bonded nonwoven and methods for their manufacture are described. The tufted nonwoven with improved stitch holding comprises a face material which tufts a bonded nonwoven comprising a mixture of a plurality of bicomponent filaments 1 with a plurality of bicomponent filaments 2 wherein iα) at least bicomponent filaments 1 exhibit a core/sheath geometry wherein component 11 represents the core and component 12 represents the sheath or iβ) at least bicomponent filaments 1 exhibit a side by side geometry wherein component 11 represents side 1 and component 12 represents side 2 or iγ) at least bicomponent filaments 1 exhibit an islands in the sea geometry wherein component 11 represents the islands and component 12 represents the sea ii) the component 11 exhibits a melting temperature T(11) and the component 22 exhibits a melting temperature T(22), iii) the component 12 exhibits a melting temperature T(12), the component 21 exhibits a melting temperature T(21) and T(12) is higher than T(21) and iv) the melting temperatures of both component 11 and 22 and the melting temperatures of components 12 and 21 obey to the relation both T(11) and T(22)>T(12)>T(21) an wherein the face material is bonded to bicomponent filaments 1 and 2 by a solidified melt of components 12 and 21.