The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8512608 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 20, 2013

Filed:

May. 16, 2011
Applicants:

Jun Koike, Sunto-Gun, JP;

Harumichi Tokuyama, Odawara, JP;

Harunobu Inami, Numazu, JP;

Yasumasa Sugiyama, Numazu, JP;

Mitsuru Koga, Mishima, JP;

Inventors:

Jun Koike, Sunto-Gun, JP;

Harumichi Tokuyama, Odawara, JP;

Harunobu Inami, Numazu, JP;

Yasumasa Sugiyama, Numazu, JP;

Mitsuru Koga, Mishima, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 45/80 (2006.01);
U.S. Cl.
CPC ...
Abstract

An injection molding device comprises a mold-clamping device that operates in both of a mold-closing state in which a mold is closed under predetermined pressure and a micro mold-open state in which the mold is held in a state in which the mold is open from the mold-closing state by a predetermined amount, an injection device that molds a molded product by injecting a molding material into the mold set to the mold-closing state or the micro mold-open state and a controller that changes a stop position of the mold in the micro mold-open state in accordance with a change of a mold-closing position when the mold-closing position of the mold in the mold-closing state is changed.


Find Patent Forward Citations

Koike, Jun. (2013). Injection molding method and injection molding device (U.S. Patent No. 8512608). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8512608

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