The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2013
Filed:
Mar. 09, 2011
Akira Furuya, Kanagawa, JP;
Yasuaki Tsuchiya, Kanagawa, JP;
Akira Furuya, Kanagawa, JP;
Yasuaki Tsuchiya, Kanagawa, JP;
Renesas Electronics Corporation, Kanagawa, JP;
Abstract
An objective of this invention is to reliably form a plating film. The following two steps are sequentially conducted: a first step of connecting a film-formation surface of a waferto a cathode electrode, making the film-formation surface inclined from the surface of a plating solutionand immersing the waferinto the plating solutionwith applying a first current between the cathode electrodeand an Cu anode electrodedisposed in the plating solution, and second step of, after immersing the film-formation surface in the plating solution, applying a second current between the cathode electrodeand the Cu anode electrodeto form a metal film on the film-formation surface by electrolytic plating. In the first step, the first current is controlled on the basis of an inclination angle between the liquid surface and the film-formation surface.