The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 20, 2013

Filed:

Dec. 21, 2010
Applicants:

Steven A. Rosenberg, Succasunna, NJ (US);

Hong Yao, Boonton, NJ (US);

Thomas Bove, Rahway, NJ (US);

Adrian Van Maurik, Zurich, CH;

Hans Peter Tschan, Moriken, CH;

Norman Blank, Uster, CH;

Inventors:

Steven A. Rosenberg, Succasunna, NJ (US);

Hong Yao, Boonton, NJ (US);

Thomas Bove, Rahway, NJ (US);

Adrian Van Maurik, Zurich, CH;

Hans Peter Tschan, Moriken, CH;

Norman Blank, Uster, CH;

Assignee:

Sika Technology AG, Baar, CH;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60J 1/00 (2006.01); E06B 3/00 (2006.01); E06B 5/00 (2006.01); E06B 7/00 (2006.01); C04B 37/00 (2006.01); C09J 4/00 (2006.01); C09J 101/00 (2006.01); C09J 201/00 (2006.01); C08G 18/08 (2006.01); C08G 18/18 (2006.01); C08G 18/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An automotive windshield replacement method which includes: a) applying an adhesive to an automotive windshield and/or an automobile body substrate, said adhesive including at least one urethane prepolymer formed from reaction materials including: i) isophorone diisocyanate and/or 4,4'-diphenylmethanediisocyanate; ii) an ethylene oxide-end-capped triol having a weight average molecular weight of about 4500 to about 5000; and iii) hexanediol adipate; b) contacting the substrates together, within the working time of the adhesive, along at least a portion of the substrate(s) to which the adhesive has been applied; and c) allowing the adhesive to bond the substrates together.


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