The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2013
Filed:
Dec. 27, 2011
Masahito Saruban, Nagaokakyo, JP;
Makoto Ogawa, Nagaokakyo, JP;
Wataru Ogawa, Nagaokakyo, JP;
Akihiro Motoki, Nagaokakyo, JP;
Syunsuke Takeuchi, Nagaokakyo, JP;
Yoji Yamamoto, Nagaokakyo, JP;
Masahito Saruban, Nagaokakyo, JP;
Makoto Ogawa, Nagaokakyo, JP;
Wataru Ogawa, Nagaokakyo, JP;
Akihiro Motoki, Nagaokakyo, JP;
Syunsuke Takeuchi, Nagaokakyo, JP;
Yoji Yamamoto, Nagaokakyo, JP;
Murata Manufacturing Co., Ltd., Kyoto, JP;
Abstract
In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.