The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8508054 B1

PDF
Full Text
Expired
Date of Patent:
Aug. 13, 2013

Filed:

Jun. 16, 2011
Applicants:

Mengzhi Pang, Irvine, CA (US);

Matthew Kaufmann, Morgan Hill, CA (US);

Inventors:

Mengzhi Pang, Irvine, CA (US);

Matthew Kaufmann, Morgan Hill, CA (US);

Assignee:

Broadcom Corporation, Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/48 (2006.01); H01L 29/40 (2006.01);
U.S. Cl.
CPC ...
Abstract

An integrated circuit (IC) device is provided. In an embodiment the IC device includes an IC die configured to be bonded onto an IC routing member and a first plurality of pads that is located on a surface of the IC die, each pad being configured to be coupled to a respective pad of a second plurality of pads that is located on a surface of the IC routing member. A pad of the first plurality of pads is offset relative to a respective pad of the second plurality of pads such that the pad of the first plurality of pads is substantially aligned with the respective pad of the second plurality of pads after the IC die is bonded to the IC routing member.


Find Patent Forward Citations

Pang, Mengzhi. (2013). Enhanced bump pitch scaling (U.S. Patent No. 8508054). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8508054

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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