The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2013
Filed:
Jul. 14, 2008
Tzong-che Ho, Hsinchu, TW;
Jason Pan, Hsinchu County, TW;
Pin Chang, Hsinchu, TW;
Chin-horng Wang, Hsinchu, TW;
Jung-tai Chen, Hsinchu County, TW;
Hsin-li Lee, Hsinchu County, TW;
Kai-hsiang Yen, Taipei, TW;
Tzong-Che Ho, Hsinchu, TW;
Jason Pan, Hsinchu County, TW;
Pin Chang, Hsinchu, TW;
Chin-Horng Wang, Hsinchu, TW;
Jung-Tai Chen, Hsinchu County, TW;
Hsin-Li Lee, Hsinchu County, TW;
Kai-Hsiang Yen, Taipei, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
An ultra thin package for an electric acoustic sensor chip of a micro electro mechanical system is provided. A substrate has a first substrate surface and a second substrate surface opposite to the first substrate surface. At least one conductor bump is formed on the second substrate surface. An electric acoustic sensor chip having a first chip surface and a second chip surface opposite to the first chip surface is provided. The first chip surface is electrically connected to the conductor bump. The conductor bump is positioned between the second substrate surface and the first chip surface to create a space. The conductor bump is used for transferring a signal from the sensor chip to the substrate. An acoustic opening passing through the substrate is formed.