The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2013

Filed:

Jun. 15, 2011
Applicants:

Munaf Rahimo, Uezwil, CH;

Ulrich Schlapbach, Liebefeld, CH;

Arnost Kopta, Zürich, CH;

Inventors:

Munaf Rahimo, Uezwil, CH;

Ulrich Schlapbach, Liebefeld, CH;

Arnost Kopta, Zürich, CH;

Assignee:

ABB Technology AG, Zurich, CH;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
Abstract

A bipolar punch-through semiconductor device has a semiconductor substrate, which includes at least a two-layer structure, a first main side with a first electrical contact, and a second main side with a second electrical contact. One of the layers in the two-layer structure is a base layer of the first conductivity type. A buffer layer of the first conductivity type is arranged on the base layer. A first layer includes alternating first regions of the first conductivity type and second regions of the second conductivity type. The first layer is arranged between the buffer layer and the second electrical contact. The second regions are activated regions with a depth of at maximum 2 μm and a doping profile, which drops from 90% to 10% of the maximum doping concentration within at most 1 μm.


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