The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2013

Filed:

Mar. 18, 2011
Applicants:

Je-hun Lee, Seoul, KR;

Chang-oh Jeong, Suwon-si, KR;

Eun-guk Lee, Yongin-si, KR;

Do-hyun Kim, Seoul, KR;

Inventors:

Je-Hun Lee, Seoul, KR;

Chang-Oh Jeong, Suwon-si, KR;

Eun-Guk Lee, Yongin-si, KR;

Do-Hyun Kim, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 29/43 (2006.01); H01L 29/49 (2006.01); H01L 29/76 (2006.01);
U.S. Cl.
CPC ...
Abstract

Provided are a wire structure, a method for fabricating a wire, a thin film transistor (TFT) substrate and a method for fabricating a TFT substrate. The wire structure includes a barrier layer formed on a substrate and including a copper layer and a copper solid solution layer.


Find Patent Forward Citations

Lee, Je-Hun. (2013). Wire structure, method for fabricating wire, thin film transistor substrate, and method for fabricating the thin film transistor substrate (U.S. Patent No. 8507956). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8507956

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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