The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2013
Filed:
Sep. 29, 2011
Kenji Miyamoto, Yokosuka, JP;
Shigeyuki Nakagawa, Yokosuka, JP;
Kenji Miyamoto, Yokosuka, JP;
Shigeyuki Nakagawa, Yokosuka, JP;
Nissan Motor Co., Ltd., Yokohama-shi, Kanagawa, JP;
Abstract
Disclosed is a bonding method for dissimilar materials made from metals and its resulting structures. The materials to be bonded are formed by layering three or more sheets such that a dissimilar material interface and a same material interface are formed. A first current is conducted between a three-sheet layered plate material wherein an aluminum alloy plate, a zinc plated steel plate and a bare steel plate, for example, are layered in order. A nugget is formed in an interface between the zinc plated steel plate and the bare steel plate, which are the same materials. Then, a second current greater than the first current is conducted, and a nugget is formed in an interface between the aluminum alloy plate and the zinc plated steel plate.