The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2013

Filed:

Feb. 15, 2011
Applicants:

Shigeo Kasahara, Kobe, JP;

Akira Tokai, Kakogawa, JP;

Manabu Inoue, Ibaraki, JP;

Naoki Kosugi, Kyoto, JP;

Toshiaki Yoshitani, Ibaraki, JP;

Inventors:

Shigeo Kasahara, Kobe, JP;

Akira Tokai, Kakogawa, JP;

Manabu Inoue, Ibaraki, JP;

Naoki Kosugi, Kyoto, JP;

Toshiaki Yoshitani, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01J 5/00 (2006.01); C03B 5/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

A structure of a panel which can be thinned down to about a panel thickness of a PDP and a manufacturing method thereof are provided. A gas filling hole is provided to a surface of a rear glass substrate of a PDP, the surface coming in contact with a front glass substrate of the PDP. Vacuuming and filling of a discharge gas are performed through the gas filling hole. After filling of the discharge gas, a mechanism for lifting solder iron up and down and supplying solder provided inside a chamber inserts a tip of an ultrasonic soldering iron into the gas filling hole to start supplying a solder which is a material for a plug sealant. When a series of forming steps of the plug sealant are finished, the ultrasonic soldering iron is retreated before the solder is solidified to finish formation of the plug sealant.


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