The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2013
Filed:
Dec. 01, 2011
Satoru Amou, Hitachi, JP;
Kosuke Kuwabara, Tokai, JP;
Tomiya Abe, Hitachi, JP;
Hiroaki Komatsu, Hitachi, JP;
Kenichi Murakami, Hitachi, JP;
Satoru Amou, Hitachi, JP;
Kosuke Kuwabara, Tokai, JP;
Tomiya Abe, Hitachi, JP;
Hiroaki Komatsu, Hitachi, JP;
Kenichi Murakami, Hitachi, JP;
Hitachi Cable, Ltd., Tokyo, JP;
Abstract
An adhesive composition includes a phenoxy resin having a bisphenol S skeleton in a structure and 10 to 100 parts by weight of a maleimide compound based on 100 parts by weight of the phenoxy resin. The maleimide compound has a plurality of maleimide groups in a structure and is at least one of a first maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 200° C. of 180 to 350 seconds and a second maleimide compound having a melting temperature of 160° C. or lower and a gelling time at 250° C. of 110 to 150 seconds. A heat resistant adhesive film may be formed by coating the adhesive composition on a substrate film, and a wiring film may have a conductor wiring layer put between such heat resistant adhesive films.