The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2013

Filed:

Oct. 28, 2010
Applicants:

Hiroyuki Hara, Chiyoda-ku, JP;

Shuichiro Sugimoto, Chiyoda-ku, JP;

Takao Hirono, Chiyoda-ku, JP;

Inventors:

Hiroyuki Hara, Chiyoda-ku, JP;

Shuichiro Sugimoto, Chiyoda-ku, JP;

Takao Hirono, Chiyoda-ku, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 27/12 (2006.01); C08K 5/05 (2006.01);
U.S. Cl.
CPC ...
Abstract

To provide a process for efficiently producing a fluorine type antifouling composition employing a short chain Rgroup, which can be made in the form of an aqueous dispersion containing substantially no volatile organic solvent and has a good soil release property (SR property). A process for producing an antifouling composition, which comprises a step of subjecting monomer components (Z) comprising from 30 to 80 mass % of a monomer (a) having a polyfluoroalkyl group in which the number of carbon atoms to which fluorine atoms are bonded is from 4 to 6, and from 20 to 70 mass % of a monomer (b) having no polyfluoroalkyl group and having a hydrophilic group, to solution polymerization in a volatile organic solvent having a boiling point of at most 100° C. in the presence of a surfactant (c) comprising an ethylene oxide adduct of 2,4,7,9-tetramethyl-5-decyne-4,7-diol to form a fluorocopolymer (A), and a step of volatilizing the volatile organic solvent after the solution polymerization and adding an aqueous medium to form an aqueous dispersion.


Find Patent Forward Citations

Loading…