The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2013
Filed:
May. 21, 2010
Seong Ah Joo, Gyeonggi-do, KR;
Chang Hoon Kwak, Seoul, KR;
NA NA Park, Seoul, KR;
IL Woo Park, Gyeonggi-do, KR;
Seong Ah Joo, Gyeonggi-do, KR;
Chang Hoon Kwak, Seoul, KR;
Na Na Park, Seoul, KR;
Il Woo Park, Gyeonggi-do, KR;
Samsung Electronics Co., Ltd., Suwon-Si, KR;
Abstract
The present invention relates to a light emitting diode package and a manufacturing method thereof. The light emitting diode package includes a substrate, an LED chip mounted on an upper part of a substrate, a molding material coated at the upper part of the substrate including an external surface of the LED chip, and an encapsulant coated at a lower part of the substrate and can improve luminous efficiency, minimize a package failure, and reduce a manufacture cost by facilitating the manufacturing process.