The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2013

Filed:

Mar. 13, 2009
Applicants:

Masaaki Ueno, Toyama, JP;

Masakazu Shimada, Toyama, JP;

Takeo Hanashima, Toyama, JP;

Haruo Morikawa, Toyama, JP;

Akira Hayashida, Toyama, JP;

Inventors:

Masaaki Ueno, Toyama, JP;

Masakazu Shimada, Toyama, JP;

Takeo Hanashima, Toyama, JP;

Haruo Morikawa, Toyama, JP;

Akira Hayashida, Toyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); B05C 11/02 (2006.01); G06F 19/00 (2011.01);
U.S. Cl.
CPC ...
Abstract

A substrate processing method in a processing chamber, has: accommodating a substrate into a processing chamber; and processing the substrate in the processing chamber on the basis of a correlation of a preset temperature of a heating device, a flow rate of fluid supplied by a cooling device and a temperature deviation between the center side of the substrate accommodated in the processing chamber and the outer peripheral side of the substrate while the substrate accommodated in the processing chamber is optically heated from an outer periphery side of the substrate at a corrected preset temperature by the heating device and the fluid is supplied to the outside of the processing chamber at the flow rate based on the correlation concerned to cool the outer peripheral side of the substrate by the cooling device.


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