The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2013
Filed:
Jun. 04, 2010
Thomas Waechtler, Dittmansdorf, DE;
Thomas Gessner, Chemnitz, DE;
Stefan Schulz, Chemnitz, DE;
Heinrich Lang, Chemnitz-Harthau, DE;
Alexander Jakob, Muelsen, DE;
Thomas Waechtler, Dittmansdorf, DE;
Thomas Gessner, Chemnitz, DE;
Stefan Schulz, Chemnitz, DE;
Heinrich Lang, Chemnitz-Harthau, DE;
Alexander Jakob, Muelsen, DE;
Fraunhofer-Gesellschaft zur Foerderung der Angewandten Forschung E.V., Munich, DE;
Technische Universitaet Chemnitz, Chemnitz, DE;
Abstract
A method can be used for the production of a coated substrate. The coating contains copper. A copper precursor and a substrate are provided. The copper precursor is a copper(I) complex which contains no fluorine. A copper-containing layer is deposited by means of atomic layer deposition (ALD) at least on partial regions of the substrate surface by using the precursor. Optionally, a reduction step is performed in which a reducing agent acts on the substrate obtained in the layer deposition step. In various embodiments, the precursor is a complex of the formula LCu(X∩X) in which L are identical or different σ-donor-π acceptor ligands and/or identical or different σ,π-donor-π acceptor ligands and X∩X is a bidentate ligand which is selected from the group consisting of β-diketonates, β-ketoiminates, β-diiminates, amidinates, carboxylates and thiocarboxylates.