The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2013
Filed:
Apr. 20, 2010
Applicants:
Kit Ying Wong, Hong Kong, CN;
Matthew Ming Fai Yuen, Hong Kong, CN;
Bing Xu, Newton, MA (US);
Inventors:
Assignee:
The Hong Kong University of Science and Technology, Kowloon, HK;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 7/04 (2006.01); B32B 37/12 (2006.01); B32B 15/04 (2006.01); B32B 15/08 (2006.01); B05D 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
An adhesion bond between a metallic surface layer and a second surface is formed by treating the layers with a material comprising sulphur-containing molecules. The sulphur-containing molecules are applied as a surface treatment of the surfaces, so that the sulphur-containing molecules act as a coupling agent to bond chemically to both substrates form nanometer-sized structures on the surfaces. The nanometer-sized structures are incorporated into a self-assembly interlayer in between the surfaces, with the interlayer forming a bond to both surfaces.