The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 13, 2013

Filed:

Dec. 08, 2010
Applicants:

James D. Harden, Benton Harbor, MI (US);

Wade J. Singler, St. Joseph, MI (US);

Inventors:

James D. Harden, Benton Harbor, MI (US);

Wade J. Singler, St. Joseph, MI (US);

Assignee:

Trelleborg Automotive USA, Inc., South Haven, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60G 11/99 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention provides an improved Micro Cellular Urethane (hereinafter 'MCU') bump stop/spring aid having a plurality of struts adapted to level the rate transition as sections are folded onto one another. MCU bump stops/spring aids are well known in the art to assist vehicle suspension systems. More particularly, bump stops/spring aids are frequently used with vehicle suspension systems in connection with shocks and strut assemblies. These assemblies provide a comfortable ride in addition to influencing the control and handling of the vehicle. The struts are positioned around the circumference of the MCU bump stop/spring aid. The added struts between the undercuts partially support the outer surfaces of the MCU bump stop/spring aid. Struts are generally molded between the outer surfaces. Struts may also be molded on an inner surface. The plurality of struts improves upon existing technology by improving performance characteristics.


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