The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2013

Filed:

Aug. 10, 2009
Applicants:

William Franklin Burgoyne, Jr., Bethlehem, PA (US);

Mark David Conner, New Tripoli, PA (US);

Andrew Francis Nordquist, Whitehall, PA (US);

William Steven Collins, Macungie, PA (US);

Inventors:

William Franklin Burgoyne, Jr., Bethlehem, PA (US);

Mark David Conner, New Tripoli, PA (US);

Andrew Francis Nordquist, Whitehall, PA (US);

William Steven Collins, Macungie, PA (US);

Assignee:

Delsper LP, Kulpsville, PA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract

A polymeric composition comprising a first polymer chosen from a poly(arylene ether) polymer including polymer repeat units of the following structure: —(O—Ar—O—Ar—O—)—(—O—Ar—O—Ar—O)n- where Ar, Ar, Ar, and Arare identical or different aryl radicals, m is 0 to 1, n is 1 m; a polysulfone, a polyimide, a poly(etherketone), a polyurea, a polyurethane, and combinations thereof and a second polymer comprising a per(phenylethynyl) arene polymer derivative. Cured films containing the polymer can exhibit at least one of the following properties: Tg from 160° C. to 180° C., a dielectric constant below 2.7 with frequency independence, and a maximum moisture absorption of less than 0.17 wt %. Accordingly, the polymer is especially useful, for example, in interlayer dielectrics and in die-attach adhesives.


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