The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2013

Filed:

Oct. 25, 2011
Applicants:

Kwang Soo Kim, Gyunggi-do, KR;

Young Ki Lee, Gyunggi-do, KR;

Sung Keun Park, Gyunggi-do, KR;

Seog Moon Choi, Seoul, KR;

Chang Hyun Lim, Seoul, KR;

Inventors:

Kwang Soo Kim, Gyunggi-do, KR;

Young Ki Lee, Gyunggi-do, KR;

Sung Keun Park, Gyunggi-do, KR;

Seog Moon Choi, Seoul, KR;

Chang Hyun Lim, Seoul, KR;

Assignee:

Samsung Electro-Mechanics Co., Ltd., Suwon, Gyunggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed herein are a power module package and a method for manufacturing the same. The power module package includes: a base substrate having grooves formed between a plurality of semiconductor device mounting areas; semiconductor devices mounted on the semiconductor device mounting areas of the base substrate; and a molding formed on the base substrate and in inner portions of the grooves.


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