The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Aug. 22, 2007
Hanako Kato, Fukuoka, JP;
Yutaka Mori, Fukuoka, JP;
Hiroshi Kobayashi, Fukuoka, JP;
Tsubasa Tomura, Fukuoka, JP;
Hanako Kato, Fukuoka, JP;
Yutaka Mori, Fukuoka, JP;
Hiroshi Kobayashi, Fukuoka, JP;
Tsubasa Tomura, Fukuoka, JP;
Mitsubishi Chemical Corporation, Tokyo, JP;
Abstract
To provide a semiconductor device member that is superior in heat resistance, light resistance, film-formation capability and adhesion, and is capable of sealing a semiconductor device and holding a phosphor without causing cracks, peelings and colorings even after used for a long period of time, the weight loss at the time of heating, measured by a predetermined weight-loss at-the-time-of-heating measurement method, is 50 weight % or lower and the ratio of peeling, measured by a predetermined adhesion evaluation method, is 30% or lower, in the semiconductor device member.