The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2013

Filed:

Dec. 29, 2010
Applicants:

Ming-te Lin, Taipei County, TW;

Ming-yao Lin, Taipei County, TW;

Sheng-chieh Tai, Taichung County, TW;

Chih-hsuan Liu, Hsinchu County, TW;

Kuang-yu Tai, Hsinchu, TW;

Inventors:

Ming-Te Lin, Taipei County, TW;

Ming-Yao Lin, Taipei County, TW;

Sheng-Chieh Tai, Taichung County, TW;

Chih-Hsuan Liu, Hsinchu County, TW;

Kuang-Yu Tai, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/08 (2010.01);
U.S. Cl.
CPC ...
Abstract

A light emitting diode (LED) package comprising a carrier, an LED chip, a lens, and a phosphor layer is provided. The LED chip disposed on the carrier. The lens encapsulating the LED chip has a plurality of fins surrounding the LED chip and a conical indentation. The fins extending backward the LED chip radially. Each of the fins has at least one light-emitting surface and at least one reflection surface adjoining the light-emitting surface. A bottom surface of the conical indentation is served as an total reflection surface. The phosphor layer is disposed on the light-emitting surfaces of the lens. An LED package and an LED module are also provided.


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