The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2013

Filed:

May. 14, 2008
Applicant:

Takaharu Hondo, Sakura, JP;

Inventor:

Takaharu Hondo, Sakura, JP;

Assignee:

Fujikura Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract

Wiring board basestoare provided with: insulating substratestohaving conductive layerstoprovided on one surfaces thereof, respectively; through-holestowhich are arranged on the insulating substrates and reach the conductive layers from the other surfaces; and conductive viastoconnected to the conductive layers by filling the through-holes with a conductive paste. In a method for manufacturing a laminated wiring board, at least one of the wiring board bases is stacked. Before the through-hole is filled with the conductive paste, a surface portion, in the through-hole, of the conductive layer is smoothed and a smooth surface portionis formed.


Find Patent Forward Citations

Hondo, Takaharu. (2013). Laminated wiring board and method for manufacturing the same (U.S. Patent No. 8502086). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8502086

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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