The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2013

Filed:

Mar. 25, 2010
Applicants:

Syouji Nogami, Tokyo, JP;

Hitoshi Goto, Tokyo, JP;

Takumi Shibata, Aichi, JP;

Tsuyoshi Yamamoto, Aichi, JP;

Inventors:

Syouji Nogami, Tokyo, JP;

Hitoshi Goto, Tokyo, JP;

Takumi Shibata, Aichi, JP;

Tsuyoshi Yamamoto, Aichi, JP;

Assignees:

Sumco Corporation, Tokyo, JP;

Denso Corporation, Aichi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/20 (2006.01); H01L 29/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor substrate which allows desired electrical characteristics to be more easily acquired, a semiconductor device of the same, and a method of producing the semiconductor substrate. The method of producing this semiconductor substrate is provided with: a first epitaxial layer forming step (S) of forming a first epitaxial layer; a trench forming step (S) of forming trenches in the first epitaxial layer; and epitaxial layer forming steps (S, S, S) of forming epitaxial layers on the first epitaxial layer and inside the trenches, using a plurality of growth conditions including differing growth rates, so as to fill the trenches, and keeping the concentration of dopant taken into the epitaxial layers constant in the plurality of growth conditions.


Find Patent Forward Citations

Loading…