The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 06, 2013
Filed:
Aug. 13, 2010
Daniel J. Woodruff, Kalispell, MT (US);
Nolan L. Zimmerman, Kalispell, MT (US);
John L. Klocke, Kalispell, MT (US);
Klaus H. Pfeifer, Kalispell, MT (US);
Kyle M. Hanson, Kalispell, MT (US);
Matthew Herset, Kalispell, MT (US);
Daniel J. Woodruff, Kalispell, MT (US);
Nolan L. Zimmerman, Kalispell, MT (US);
John L. Klocke, Kalispell, MT (US);
Klaus H. Pfeifer, Kalispell, MT (US);
Kyle M. Hanson, Kalispell, MT (US);
Matthew Herset, Kalispell, MT (US);
Applied Materials, Inc., Santa Clara, CA (US);
Abstract
An electroplating apparatus having improved contact deplating features includes a bowl assembly having a bowl for holding an electroplating solution. A head having a rotor including a contact ring and a head motor for rotating the rotor cooperates with the bowl assembly during plating operations. A lift/rotate actuator may be used to move the head to position a sector of the contact ring in a ring slot or opening of a deplating module. Since the deplating is performed within the deplating module, and not within the bowl assembly, the electroplating solution in the bowl assembly is not affected by the deplating process.