The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 06, 2013

Filed:

Aug. 25, 2011
Applicants:

Shia-chung Chen, Taoyuan County, TW;

Ping-shun Hsu, Taoyuan County, TW;

Jen-an Chang, Taoyuan County, TW;

Shyh-shin Hwang, Taoyuan County, TW;

Chia-yen Tseng, Taoyuan County, TW;

Inventors:

Shia-Chung Chen, Taoyuan County, TW;

Ping-Shun Hsu, Taoyuan County, TW;

Jen-An Chang, Taoyuan County, TW;

Shyh-Shin Hwang, Taoyuan County, TW;

Chia-Yen Tseng, Taoyuan County, TW;

Assignee:

Chung Yuan Christian University, Taoyuan County, TW;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B29C 44/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A counterpressure/temperature control apparatus, comprises: a mold, having a runner and an air passage, both coupled to a mold cavity inside the mold; a logic control valve, coupled to the air passage for controlling a high-temperature gas or/and a counterpressure gas to flow in and out the mold cavity; a counterpressure gas supplying device, for supplying the counterpressure gas to the mold cavity through the logic control valve; and a high-temperature gas supplying device, for supplying the high-temperature gas to the mold cavity through the logic control valve; wherein the mold cavity is heated by the high-temperature gas, while subjecting the same to a counterpressure provided from the counterpressure gas supplying device during an injection molding process, and thereby, not only the surface quality of a product resulting from the injection molding process can be improved, but also the size of foams and the distribution evenness thereof are enhanced.


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